OMP (Open Material Program)
The OMP (Open Material Program) is a collaboration between Raise3D with Filament Manufacturers and Resin Manufacturers to identify and select top performing certified third-party filaments and resins for Raise3D printers.
Pro3 HS Series
FFF • Dual Extrusion • High-Speed Printing up to 300mm/s • RFID Traceable Workflow
RMS220
SLS • Low TCO • High Output • High-Precision Prints • Industrial and Functional Material
DF2+ (DLP Resin)
DLP • True DLP Precision • Faster Prints • RFID Traceable Workflow • Broad Resin Portfolio
DF2 (DLP Resin)
DLP • High Resolution Resin Printing • RFID Traceable Workflow • Wide Range of Resin Compatibility
E2CF
FFF • Dual IDEX • For Fiber-Reinforced Filaments • Dry Boxes • Enclosed Build Chamber
E2
FFF • Dual IDEX • For Flexible Materials up to Shore Hardness 70A • Enclosed Build Chamber
RMF500
Large-Format FFF (500 × 500 × 500 mm) • Dual IDEX • Carbon Fiber Composites & High-Strength Polymer
