Raise3D DF2 Solution
Beyond Prototyping: Traceable Workflow from Start to Finish
The Raise3D DF2 Solution is a Digital Light Printing (DLP) printing system that provides fast printing speeds, smooth surfaces, high precision, and exceptional reliability. It is designed for engineering prototyping, manufacturing aids, and low-volume production using a wide variety of high-performance resins. Discover the efficient workflow via RFID as we redefine the possibilities of resin 3D printing.
The Raise3D DF2 Solution utilizes RFID technology to seamlessly integrate hardware, software, and materials, offering users a streamlined workflow without the need for manual entry of process settings. This not only saves operational time but also ensures a consistent workflow, which is critical for production.
Compared to the time-consuming and messy workflow of DLP, the Raise3D DF2 printer, DF Wash and DF Cure come with an RFID-tag-integrated smart build plate and a logical interface that ensures a cleaner and simpler workflow throughout the printing, washing and curing process. This not only streamlines manual operations but also ensures your printing tasks are always accomplished with the same print results.
Raise3D High Performance Engineering Resins: Meet demands for customized small batch production of precise prototyping and industrial engineering parts.
ORP (Open Resin Program): The aim of the ORP is to open to third-party resin manufacturers to develop high-performance resins, including co-branding with BASF and Henkel, to provide customers with a wider range of resin options.
Suitable for applications working with optical or showcasing internal features
(The High Clear Resin will be launched soon)
High temperature resistant material for harsh thermal environments
(The High Temp Resin will be launched soon)
Raise3D has partnered with third-party resin manufacturers such as BASF and Henkel to develop co-branded resins, including LOCTITE 3D IND405™, and LOCTITE 3D PRO476™, Ultracur3D® RG 3280, and Ultracur3D® RG 1100 B. This collaborative effort makes these resins an ideal choice for applications ranging from prototyping to intricate engineering projects.
XY Resolution: 2560 x 1440
From intricate model designs to complex engineering prototypes, Raise3D DF2 printer adopts top performing optical components, so that every detail is captured with the utmost accuracy.
Bigger, Faster, Better
200 x 112 x 300 mm
Max. up to 10 kg
From large-scale prototypes to intricate models, Raise3D DF2 printer makes it easy.
The Raise3D DF2 printer adapts effortlessly to the scale of production and maintains consistent quality.
RFID automatically stores and reads the relevant parameters of an entire workflow for printing, washing and curing, and is easy to mount and unmount, reducing the need for tedious manual operations.
The Raise3D DF2 printer is equipped with a high-performance touch screen for a better user experience:
Maximum load capacity of 200 kg for Z-axis. Features no staggered layers and high movement accuracy, ensuring the stability of printing large parts and extended use.
Air peel design between the resin vat bottom and the highly clear glass reduces the force from 50 kilograms to 10 kilograms, effectively peeling each layer and ensuring successful printing.
High-quality optical components are used throughout the entire optical path projection system to reduce loss, eliminate dispersion, ensuring the reproduction of sharp layers.
High-Transparency nFEP Film
97% Transmittance 97%
Optical Glass made by Schott Germany
Tempered + Oleophobic Coating
Texas Instruments’ First Industrial-grade DMD Chip Dedicated for 405 nm 3D Printing
2560 x 1440 Resolution
Coating Specialized for 405 nm Wave
LED Light Source (402 nm ± 1 nm) with Both Active & Passive Cooling
High Thermal Radiating Copper Pipe + Cooling Fan
Lens Optimized for DLP Technology
Multi-Piece Full Glass Structure
When the ultrasonic liquid level detects a lack of material, the resin dosing device will automatically replenish the container with material.
ideaMaker has added multiple new features that are compatible with Raise3D DF2 printer, reducing learning curves and improving the success rate of DLP printing.
Print Technology: Digital Light Printing (DLP)
Build Size (W × D × H): 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 inch)
XY Resolution: 2560 x 1440
Max Z Workload: 10 kg
Max Printing Speed: 25 mm/h (0.1 mm per layer)
Layer Height: 50-100 micron
Resin Management: Auto Resin Feeding, Resin Level Detection, Resin Confirmation
Control Panel: Touch Screen (Resolution: 1920 × 720) with Magic Layout (Allow to easily adjust the print layout and duplicate prints)
RFID Print Platform: Record the type of resin used and the printing, washing and curing settings
Level Calibration: Calibrated in factory
Chamber Heating: Max 40℃
Raise3D Resins: Raise3D Standard White Resin, Raise3D High Detail Apricot Resin, Raise3D Tough 2K Grey Resin, Raise3D Rigid 3K Grey Resin, Raise3D High Clear Resin (Coming soon), Raise3D High Temperature Resin (Coming soon)
Co-branding Resins with BASF and Henkel: LOCTITE 3D IND405™, LOCTITE 3D PRO476™, Ultracur3D® RG 3280, Ultracur3D® RG 1100 B
ORP (Open Resin Program): Coming soon
Washing Tank Volume: 14L
Max Washing Size: 200 x 112 x 300 mm (7.87 x 4.41 x 11.8 inch)
Compatible Solvent: IPA, Water, TPM
Washing Features: Twin-turbo Washing, Hand Washing Simulation
Drying Feature: Double Fan Air Drying
Drainage: Automatic Liquid Drainage with Waste Container
Wash Profile: RFID Auto Set or Manual Entering
Max Curing Size: φ 230 x 300 mm (φ 9 x 11.8 inch)
Curing Source: LED (365nm, 385nm, 405nm mixed); Max Air Heating Temperature up to 120℃
Cure Profile: RFID Auto Set or Manual Entering