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Raise3D DF2 Solution

Beyond Prototyping: Traceable Workflow from Start to Finish

The Raise3D DF2 Solution is a Digital Light Printing (DLP) printing system that provides fast printing speeds, smooth surfaces, high precision, and exceptional reliability. It is designed for engineering prototyping, manufacturing aids, and low-volume production using a wide variety of high-performance resins. Discover the efficient workflow via RFID as we redefine the possibilities of resin 3D printing.

End-to-End DLP Printing Workflow

The Raise3D DF2 Solution utilizes RFID technology to seamlessly integrate hardware, software, and materials, offering users a streamlined workflow without the need for manual entry of process settings. This not only saves operational time but also ensures a consistent workflow, which is critical for production.

Compared to the time-consuming and messy workflow of DLP, the Raise3D DF2 printer, DF Wash and DF Cure come with an RFID-tag-integrated smart build plate and a logical interface that ensures a cleaner and simpler workflow throughout the printing, washing and curing process. This not only streamlines manual operations but also ensures your printing tasks are always accomplished with the same print results.

Resin Compatibility: Expanding Possibilities in 3D Printing


Raise3D High Performance Engineering Resins: Meet demands for customized small batch production of precise prototyping and industrial engineering parts.

ORP (Open Resin Program): The aim of the ORP is to open to third-party resin manufacturers to develop high-performance resins, including co-branding with BASF and Henkel, to provide customers with a wider range of resin options.


Easy-to-print resin for prototyping and design


High-resolution material for detailed models


Tough and durable resin for functional applications


Material with high strength, rigidity and heat-resistance


Suitable for applications working with optical or showcasing internal features

(The High Clear Resin will be launched soon)

High temperature resistant material for harsh thermal environments

(The High Temp Resin will be launched soon)

Co-branding Resins with Third-party Resin Manufacturers

Raise3D has partnered with third-party resin manufacturers such as BASF and Henkel to develop co-branded resins, including LOCTITE 3D IND405™, and LOCTITE 3D PRO476™, Ultracur3D® RG 3280, and Ultracur3D® RG 1100 B. This collaborative effort makes these resins an ideal choice for applications ranging from prototyping to intricate engineering projects.

High-precision Printing Reproduces Every Tiny Detail

XY Resolution: 2560 x 1440

From intricate model designs to complex engineering prototypes, Raise3D DF2 printer adopts top performing optical components, so that every detail is captured with the utmost accuracy.





Professional Competence for More Possibilities

Bigger, Faster, Better

200 x 112 x 300 mm

Max. up to 10 kg

From large-scale prototypes to intricate models, Raise3D DF2 printer makes it easy.





Small Batch Production with Consistent Prints

The Raise3D DF2 printer adapts effortlessly to the scale of production and maintains consistent quality.






Smooth Workflow

Consistently Printing Every Time

High Precision Image Quality

Industrial Grade Optical Components

High-quality optical components are used throughout the entire optical path projection system to reduce loss, eliminate dispersion, ensuring the reproduction of sharp layers.

High-Transparency nFEP Film 

97% Transmittance 97%

Optical Glass made by Schott Germany

92% Transmittance

Tempered + Oleophobic Coating

Reflective Mirror with Front Aluminium Coating

98% Reflectivity

Reduced Loss, Eliminated Dispersion and Fine Imaging

Texas Instruments’ First Industrial-grade DMD Chip Dedicated for 405 nm 3D Printing

2560 x 1440 Resolution

Coating Specialized for 405 nm Wave

LED Light Source (402 nm ± 1 nm) with Both Active & Passive Cooling

High Thermal Radiating Copper Pipe + Cooling Fan

Low-distortion Glass 

Lens Optimized for DLP Technology  

Multi-Piece Full Glass Structure

TV Distortion<0.1%

Efficient Material Management

Improved First Print Success Rate by ideaMaker

ideaMaker has added multiple new features that are compatible with Raise3D DF2 printer, reducing learning curves and improving the success rate of DLP printing.


Technical Specifications

Raise3D DF2 printer

Print Technology: Digital Light Printing (DLP)
Build Size (W × D × H): 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 inch)
XY Resolution: 2560 x 1440
Max Z Workload: 10 kg
Max Printing Speed: 25 mm/h (0.1 mm per layer)
Layer Height: 50-100 micron
Resin Management: Auto Resin Feeding, Resin Level Detection, Resin Confirmation
Control Panel: Touch Screen (Resolution: 1920 × 720) with Magic Layout (Allow to easily adjust the print layout and duplicate prints)
RFID Print Platform: Record the type of resin used and the printing, washing and curing settings
Level Calibration: Calibrated in factory
Chamber Heating: Max 40℃


Raise3D Resins: Raise3D Standard White Resin, Raise3D High Detail Apricot Resin, Raise3D Tough 2K Grey Resin, Raise3D Rigid 3K Grey Resin, Raise3D High Clear Resin (Coming soon), Raise3D High Temperature Resin (Coming soon)
Co-branding Resins with BASF and Henkel: LOCTITE 3D IND405™, LOCTITE 3D PRO476™, Ultracur3D® RG 3280, Ultracur3D® RG 1100 B
ORP (Open Resin Program): Coming soon

Raise3D DF Wash

Washing Tank Volume: 14L
Max Washing Size: 200 x 112 x 300 mm (7.87 x 4.41 x 11.8 inch)
Compatible Solvent: IPA, Water, TPM
Washing Features: Twin-turbo Washing, Hand Washing Simulation
Drying Feature: Double Fan Air Drying
Drainage: Automatic Liquid Drainage with Waste Container
Wash Profile: RFID Auto Set or Manual Entering

Raise3D DF Cure

Max Curing Size: φ 230 x 300 mm (φ 9 x 11.8 inch)
Curing Source: LED (365nm, 385nm, 405nm mixed); Max Air Heating Temperature up to 120℃
Cure Profile: RFID Auto Set or Manual Entering