Raise3D resin 3D printers are built to provide exceptional surface quality, fine feature resolution, and reliable part consistency—ideal for applications ranging from detailed prototypes to functional end-use components. Resin printing enables smooth finishes, sharp edges, and a wide choice of materials suited to engineering, manufacturing, and product design. Our resin printers utilize DLP technology, ensuring high accuracy, faster print speeds, and reproducible results across every project.
DF2 and DF2+ combine industrial‑grade optics, an RFID‑powered workflow, and Air‑Peel technology to deliver smooth surfaces, sharp details, and consistent results—from rapid prototyping to low‑volume production.
Choose the model that matches your throughput and workflow needs.

Ideal for rapid prototyping and small‑batch manufacturing with higher light intensity for faster curing and enhanced optics.

Optimized for engineering prototyping, manufacturing aids, and low‑volume production with smooth surfaces and refined details.
RFID auto‑profiles each step to minimize manual inputs and reduce errors.
Industrial‑grade DLP optics with Air‑Peel and a heavy‑duty Z‑axis for reliable, repeatable results.
TI industrial‑grade DMD
Magic Layout on 10.25″ touchscreen
14 L washing tank with twin‑turbo agitation, IPA/TPM compatible, and automatic liquid drainage.
Max washing size: 200 × 112 × 300 mm
Hand‑wash simulation + double‑fan air drying
RFID auto‑set or manual profiles
Mixed‑wavelength LEDs (365/385/405 nm) with air heating up to 120 °C for robust post‑cure results.
Max curing size: φ230 × 300 mm
RFID auto‑set or manual profiles
Run Raise3D engineering resins or approved partners via the OMP (Open Material Platform).
Raise3D Resins OMP (Open Material Platform)
OMP available free of charge. Print partner resins in‑house and adjust parameters to meet your application requirements.
From first concept to end‑use parts and production tooling.
Mimic mechanical, thermal, and chemical properties of final materials. Iterate and validate designs within a day.
High performance and precision for small‑batch production across automotive, aerospace, consumer goods, and electronics.
Durable, repeatable parts with wear resistance for the factory floor.
Powerful tools that simplify setup, expand design possibilities, and increase first‑print success.
Antialiasing
Contour Compensation
Auto Support
Auto Orientation
Auto Cross‑Section Analysis
Suction Cup Detection
Hollowing & Drainage Holes
Texture Generation
Smaller G‑code Size
A 10.25″ touchscreen lets you duplicate prints and adjust layouts without returning to the slicer. Automatic Pre‑Print Inspection verifies resin type, build platform and feeding station installation, resin margin, and more.
Consistency from batch to batch.
Verify resin types and automatically apply optimized print, wash, and cure profiles. Reduce manual steps and minimize human error at scale.
Integrated with ideaMaker
Automated DF2/DF2+, DF Wash & DF Cure settings
Real‑time resin level detection (DF2+)
Texas Instruments industrial DMD, optimized light path, and high‑transparency film ensure crisp layers and smooth surfaces.
Air‑Peel reduces peel force ~50 kg → ~10 kg
High‑load Z‑axis: 200 kg static load; up to 10 kg part weight
Digital Light Printing (DLP)
Digital Light Printing (DLP)
200 × 112 × 300 mm (7.87 × 4.41 × 11.8 in)
200 × 112 × 300 mm (7.87 × 4.41 × 11.8 in)
80 mm/h (0.2 mm per layer)
100 mm/h (Draft resin, 200 μm layer height)
—
50–60 mm/h (avg at 100 μm; varies by resin/geometry)
2560 × 1440
2560 × 1440
50–200 μm
50–200 μm
Yes
Yes
TI industrial DMD; high‑transparency nFEP; optical glass
Doubled light intensity; enhanced optics; optimized HTF film
Yes
Yes
Heavy‑duty; up to 200 kg static load; 10 kg part
Heavy‑duty
Raise3D + OMP partners
Raise3D + broader OMP incl. ESD/FR
Print Technology: Digital Light Printing (DLP)
Build Size (W×D×H): 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 in)
XY Resolution: 2560 × 1440
Max Part Weight: 10 kg
Max Printing Speed: 80 mm/h (0.2 mm per layer)
Layer Height: 50–200 μm
Resin Management: Auto Resin Feeding, Resin Level Detection, Resin Confirmation
Control Panel: 10.25″ Touchscreen (1920 × 720) with Magic Layout
RFID Print Platform: Records resin type and print/wash/cure settings
Level Calibration: Calibrated in factory
Chamber Heating: Max 40 °C
Optical: TI industrial‑grade DMD; high‑transparency nFEP; optical glass (Schott)
Air‑Peel: Peel force reduction (~50 kg → ~10 kg)
Supported Resins (Raise3D): Standard White; High Detail
Apricot; Tough 2K Grey; Rigid 3K Grey; High Clear; High Temperature (coming soon)
OMP Partners: LOCTITE 3D IND405; LOCTITE 3D PRO476; Ultracur3D RG 3280; Ultracur3D RG 1100 B
Print Technology: Digital Light Printing (DLP)
Build Size (W×D×H): 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 in)
Max Printing Speed: 100 mm/h (Using Draft Resin at 200 μm; varies by geometry & environment)
General Printing Speed: 50–60 mm/h (Average at 100 μm; varies by resin, layer height, and geometry)
XY Resolution: 2560 × 1440
Layer Height: 50–200 μm
Optics: Doubled light intensity; enhanced optical path; optimized HTF film
Sensors: Ultrasonic resin level detection
RFID Workflow: Integrated with ideaMaker to auto‑apply print/wash/cure settings
Supported Resins (Raise3D): Standard White; High Detail Apricot; Tough 2K Grey; Rigid 3K Grey; ESD; High Clear; Draft Grey; Standard Black; (High Temperature coming soon)
OMP Partners: LOCTITE 3D IND405; PRO476; 3843; PRO410; PRO417; IND147; IND403; IND5714; Ultracur3D RG 3280; RG 1100 B; EL 60; EL 4000; RG9400 B FR (others coming soon)
Washing Tank Volume: 14 L
Max Washing Size: 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 in)
Compatible Solvents: IPA, TPM
Features: Twin‑turbo Washing; Hand‑Wash Simulation; Double‑Fan Air Drying
Drainage: Automatic Liquid Drainage with Waste Container
Wash Profile: RFID Auto‑Set or Manual Entry
Max Curing Size: φ230 × 300 mm (φ9 × 11.8 in)
Curing Source: LEDs (365 / 385 / 405 nm mixed); air‑heating up to 120 °C
Profiles: RFID Auto‑Set or Manual Entry
Request a free sample part printed on DF2 or DF2+.
High‑definition detail from DLP projection with antialiasing and contour compensation for crisp edges and smooth curves.
Air‑Peel and ideaMaker automation increase first‑print success, reducing time‑consuming reprints.
A quick primer to help teams choose the right resin technology.
Projects a full layer at once for sharp details and high throughput; excellent for small features and smooth surfaces.
A laser cures resin point‑by‑point; strong parts with fine features; speed depends on geometry.
Uses an array of UV LEDs that shine through an LCD mask to cure an entire layer at once; ideal for rapid prototyping and consumer grade parts.
DF Wash supports IPA and TPM. Always follow local regulations and safety data sheets for handling and disposal.
Yes. DF2 and DF2+ support an Open Material Platform (OMP) with approved partner resins from Henkel (LOCTITE) and Forward AM (Ultracur3D). DF2+ also enables parameter tuning for specific applications.
Up to 100 mm/h using Draft Resin at 200 μm layer height (actual print time varies by part geometry, resin, and environment). Typical speeds are 50–60 mm/h at 100 μm across Raise3D materials.
RFID automatically verifies resin type and applies matching print, wash, and cure profiles across the ecosystem—reducing manual steps and helping achieve reproducible results batch‑to‑batch.
Air‑Peel reduces peel forces; ideaMaker provides Auto Support/Orientation, Suction Cup Detection, and Pre‑Print Inspection. The heavy‑duty Z‑axis and ultrasonic resin sensing (DF2+) further improve stability.
Get pricing, lead times, and guidance for your application.
We’ll help you choose the right configuration and materials for your workflow.
• Email: salesadmin@raise3d.us
• Phone: +1 888-963-9028
• Hours: Mon–Fri, 9:00–18:00