Hyper Speed PLA Pro

An easy to print and premium carbon powder finish filament for Hyper FFF®

Raise3D Hyper Speed PLA Pro is a composite filament specially designed for the Hyper FFF®. The addition of carbon powder and other additives enhances the matte finish surface, and after using the ironing function, the surface smoothness can be significantly improved. Additionally, while the interlayer adhesion is slightly lower than Premium PLA, the material outperforms Premium PLA in terms of rigidity, tensile strength, and impact resistance. This material is ideal for rapid prototyping and the rapid production of small exterior parts without the need for molds.

  • Colorful and matte CF finish
  • almost invisible layer lines
  • High speed printing up to L3 (500 mm/s)
  • High rigidity and strength

 

Compatibility

Printer: Raise3D E3/ Raise3D Pro3 HS Series/ Raise3D Pro3 Series with Hyper Speed Upgrade Kit/ Raise3D RMF500

Filament: Raise3D Industrial PET Support

 

Raise3D Hyper Speed PLA Pro Filament

 

Applications

  • Prototyping
  • Structural components
  • Jigs and fixtures
  • Functional models

Benefits

  • Colorful and unique matte finish
  • High speed printing
  • High rigidity & strength

Printing Guide


Recommended Print Settings

Nozzletemperature_icon
Nozzle temperature (°C)
210-220℃
Bedtemperature_icon
Bed temperature (°C)
55℃
Layerheight_icon
Layer height (mm)
0.1-0.2 mm
Printingspeed_icon
Printing speed (mm/s)
50-500 mm/s
Coolingfan_icon
Cooling fan
On
Dryingtemperature_icon
Drying temperature (°C)
60°C for 8 to 12 hours

Printing Notifications:

  • Dry Hyper Speed PLA Pro at 60°C for 8-12 hours before printing, as low moisture content is crucial for final printed part quality.
  • After drying, we recommend storing Hyper Speed PLA Pro filaments inside Raise3D Filament Dry Box during the printing process.


For ideaMaker Users:

Choose the right printing profile for Hyper Speed PLA Pro on ideaMaker IO and use it on ideaMaker. Download the latest version of ideaMaker.


Hyper Speed PLA Pro

Find out more in our OMP section