FFF • Dual Extrusion • High-Speed Printing up to 300mm/s • RFID Traceable Workflow
SLS • Low TCO • High Output • High-Precision Prints • Industrial and Functional Material
DLP • True DLP Precision • Faster Prints • RFID Traceable Workflow • Broad Resin Portfolio
DLP • High Resolution Resin Printing • RFID Traceable Workflow • Wide Range of Resin Compatibility
FFF • Dual IDEX • For Fiber-Reinforced Filaments • Dry Boxes • Enclosed Build Chamber
FFF • Dual IDEX • For Flexible Materials up to Shore Hardness 70A • Enclosed Build Chamber
Large-Format FFF (500 × 500 × 500 mm) • Dual IDEX • Carbon Fiber Composites & High-Strength Polymer
Current Updates Read more about the new features added in ideaMaker 5.2.4 Version 5.2.4 – May 27, 2025 Added DLP Features Added new DLP slicing templates Read more about the new features added in ideaMaker 5.2.3 Version 5.2.3 – Apr. 24, 2025 Added FFF & DLP Features Added new DLP slicing templates Added new […]
Raise3D Technologies Inc. This Software/Firmware License Agreement (“Agreement”) is a binding agreement between you (“Licensee” or “you”) and Raise 3D Technologies Inc. (“Licensor”). This Agreement governs your use of any software and firmware (including all related documentation, the “Software”) utilized in operating any printer manufactured by Licensor, including the E2CF, the Pro3, the Pro3 […]